Assembly Process Engineering Director

NXP Manufacturing (Thailand) Ltd. (Bangkok)

Bangkok, Thailand

NXP Manufacturing (Thailand) Ltd., established in Bangkok in 1974, operates as a modern semiconductor facility specializing in the assembly and testing of integrated circuits (ICs). With a production area spanning 55,220 square meters, the company is dedicated to manufacturing standard products, microcontrollers, and mixed-signal ICs for markets such as automotive, secure banking, mobile audio, and standard logic. Their commitment to quality, supported by a team of over 3,600 members, ensures the production of high-quality ICs for the global electronics market. NXP Thailand fosters an environment where team members feel valued and can grow their competences, making it an excellent workplace choice

Detail posisi

Leading and managing all the activities of Assembly Process in ATBK, working together with various groups (particularly Manufacturing, Equipment, and Packaging Innovation) to meet business objectives.

Kewajiban

• Management Team member of NXP Bangkok to drive site decision aligning with NXP values and mission.
• Drive process standardization, best practices, and talent retention & growth for organization sustainability.
• Establishing & maintaining the production standard work meeting process control requirements.
• Own & drive area KPIs to meet performance target (Safety, Quality, Delivery, Costs, Yield).
• Define, develop and establish process capabilities, strategy and roadmap.
• Develop a strategy to develop new capabilities or to overcome process constraints.
• Collaborate with Innovation NPI/NTI team to enable successful NPI/NTI launch with robust Safe Launch closure.
• Attend and own all BCAM related review on NPI/NTI to ensure risk to process margin/manufacturability is mitigated upfront.
• Constantly on the lookout for new material suppliers / new technology and capability.
• Specifically on risk assessment and process flow optimization, playing the Integrator role of Assembly process from wafer to package finished good.
• Ensure business continuity in process, working with Purchasing to identify critical suppliers and develop 2nd sourcing strategy.
• Maintain a matrix on process capabilities and constraints.
• Work with UG/Equipment counterpart on equipment benchmarking.

Kualifikasi

• Bachelor Degree in relevant engineering fields.
• 8+ Years of Experience in Semiconductor industry is mandatory.
• Competent in NPI development, quality, or problem solving skill will be added advantage.
• Experience with various DOE methodology, proficient in statistical tools for decision making, knowledgeable in JMP software or equivalent.
• Knowhow in wire bond technology including bonding diagram analysis, Cu wire bonding, and engagement with equipment team on Wirebonder MTBA improvement.
• Experience in running engineering teams in wire bond, die bond, or mold.
• Strong leadership skills with good communication.
• Excellent data analysis and data interpretation skills.
• Ability to make sound data-driven decisions.
• Hands on, strong ownership, and able to collaborate as team player.