Die Bond & Wire Bond, Process Engineer
Hana Semiconductor (Ayutthaya) Co., Ltd. (Phra Nakhon Si Ayutthaya)
Ayutthaya,
Thailand
Hana Semiconductor (Ayutthaya) Co., Ltd. established in 1997 specializes in the IC assembly and test of low to medium pin count IC’s. We offer state of the art assembly processes (including Copper Wire, Chip on Lead, Multi-Die, Stacked Die, Clear Molding etc.) and test solutions.
Detail posisi
The position of Die Bond & Wire Bond, Process Engineer involves overseeing and improving the IC assembly processes, specifically focusing on die bonding and wire bonding techniques.
Kewajiban
• Oversee the die bond and wire bond processes
• Improve process efficiency and yield
• Troubleshoot and resolve process-related issues
• Collaborate with cross-functional teams to enhance product quality
• Conduct training for team members on best practices
Kualifikasi
• Bachelor’s Degree or higher in Electronics, Electrical or Mechanical Engineering or related field
• At least 2-5 years of work experience in IC assembly process engineer background preferably in Wire Bond or Die Bond
• Good command of written and spoken English
• Computer skill: Microsoft Office