2024 - 2025 Process Development Engineer Intern

NXP Manufacturing (Thailand) Ltd. (Bangkok)

Bangkok, Thailand

NXP Manufacturing (Thailand) Ltd., established in Bangkok in 1974, operates as a modern semiconductor facility specializing in the assembly and testing of integrated circuits (ICs). With a production area spanning 55,220 square meters, the company is dedicated to manufacturing standard products, microcontrollers, and mixed-signal ICs for markets such as automotive, secure banking, mobile audio, and standard logic. Their commitment to quality, supported by a team of over 3,600 members, ensures the production of high-quality ICs for the global electronics market. NXP Thailand fosters an environment where team members feel valued and can grow their competences, making it an excellent workplace choice

About this position

The Process Development Engineer Intern will support Wire bond Assembly Package Innovation Engineers in various development projects and special initiatives aimed at improving wire bond processes and cost reduction.

Responsibilities

• Support Wire bond Assembly Package Innovation (API) Engineers on daily activities related to their Development Projects
• Will be assigned to work on Special Projects for improvement of wire bond process
• Will be assigned to support Cost reduction projects; such as UPH improvement
• Will collaborate with their University Professor to do research on technical papers/ journals for deeper understanding on the solution of the problems encountered with wire bond process

Requirements

• The candidate must be studying a bachelor’s degree in Micro- Electronic. Electronic and other Engineering.
• Interpersonal skills
• English communication skills, both written and spoken
• Experienced in making presentation/s using Microsoft Power Point software
• Experienced in using Microsoft Excel software to be used for data gathering and analysis