Senior R&D Process Engineer
About this position
Responsibilities
Key responsibilities consist of optical assembly process development to achieve target cycle time and yield. The main focus may consist of:
• Engage with cross-functional product development teams to product design engineers, equipment design engineers, manufacturing, and external vendors to understand the product design and characteristics and develop robust assembly processes for highly integrated optical components.
• Develop optical assembly process including visual inspection, mechanical assembly, hermetic and non-hermetic sealing, large area bonding process, surface treatment optimization and so on.
• Develop optical assembly process using PDCA approach with process data analysis to improve process and product performance with manual and automatic tools.
• Author and execute process validation activities to ensure sustainable production speed and product quality. Design and conduct DOE using optomechanical principles, theories, and concepts to develop optical active alignment process to improve product performance.
• Perform process capability and product performance summary in weekly basis, and present to cross-functional product development teams.
• Support an environment conducive to effective cross-team interaction and self-initiates applicable information sharing.
• Demonstrate trouble shooting and problem-solving ability in manufacturing processes.
• Support product development teams as requested including required standard documents preparation for Design and business reviews such as PFMEA, Cycle time, Failure analysis etc. Provide technical work instructions, standard works, visual aids, and training to NPI team members.
• Able travel and work at other Lumentum sites (local and abroad).
Requirements
Qualifications:
• Bachelor’s degree or above in material sciences, mechanics, electronics, or related field of study.
• 6+ years of experience for bachelor’s degree, or 4+ years of experience for master’s degree in microelectronic manufacturing processes and/or product performance electrical/optical evaluation using semi/fully automated machine or equipment.
• Experience in advanced manufacturing environment. Able to optimize process parameter aiming for better product performance and manufacturing productivity.
• Experience in electronic chip assembly, mechanical assembly process, or box-build assembly such as die-bonding, wire-bonding, hermetic sealing for both metal and non-metal packaging.
• Experience in process optimization and process characterization such as epoxy size and volume control, bonding joint strength test, contact-angle evaluation and so on.
• Experience in process related data analysis to verify process capability (Cpk, parameter distribution e.