Die Bond & Wire Bond, Process Engineer
Hana Semiconductor (Ayutthaya) Co., Ltd. (Phra Nakhon Si Ayutthaya)
Ayutthaya,
Thailand
Hana Semiconductor (Ayutthaya) Co., Ltd. established in 1997 specializes in the IC assembly and test of low to medium pin count IC’s. We offer state of the art assembly processes (including Copper Wire, Chip on Lead, Multi-Die, Stacked Die, Clear Molding etc.) and test solutions.
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Job function:
Engineering
About this position
Responsibilities
• Oversee die bond and wire bond processes
• Implement process improvements
• Collaborate with cross-functional teams
• Ensure quality standards are met
• Troubleshoot and resolve process issues
• Train and mentor junior engineers
Requirements
• Bachelor’s Degree or higher in Electronics, Electrical or Mechanical Engineering or related field
• At least 2-5 years of work experience in IC assembly process engineer background preferably in Wire Bond or Die Bond
• Good command of written and spoken English
• Computer skill: Microsoft Office
Benefits
Huneety A.I Salary Estimate
25,000 - 48,000 THB per month
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