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About this position

The position of Die Bond & Wire Bond, Process Engineer involves overseeing and improving the IC assembly processes, specifically focusing on die bonding and wire bonding techniques.

Responsibilities

• Oversee the die bond and wire bond processes
• Implement process improvements to enhance efficiency and quality
• Collaborate with cross-functional teams to resolve technical issues
• Conduct training for operators on best practices and new technologies
• Monitor and analyze process performance metrics
• Ensure compliance with industry standards and regulations

Requirements

• Bachelor’s Degree or higher in Electronics, Electrical or Mechanical Engineering or related field
• At least 2-5 years of work experience in IC assembly process engineer background preferably in Wire Bond or Die Bond
• Good command of written and spoken English
• Computer skill: Microsoft Office

Benefits