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Die Bond & Wire Bond, Process Engineer
About this position
Responsibilities
• Oversee the die bond and wire bond processes
• Improve process efficiency and yield
• Troubleshoot and resolve process-related issues
• Collaborate with cross-functional teams to enhance product quality
• Conduct training for team members on best practices
Requirements
• Bachelor’s Degree or higher in Electronics, Electrical or Mechanical Engineering or related field
• At least 2-5 years of work experience in IC assembly process engineer background preferably in Wire Bond or Die Bond
• Good command of written and spoken English
• Computer skill: Microsoft Office