Sr./Jr. Process Engineer Wire bond/Die Attach (Pathumthani)

Fabrinet (Pathum Thani)

Pathumthani, Thailand

Fabrinet is the trusted manufacturing partner of the world’s most demanding OEMs. We offer a full range of services. We provide complex optical and electro-mechanical components, modules, and bulk optics. These components serve the markets of data communications, telecommunications, networking, medical devices, and automotive technologies. Our customers are top-tier OEMs. We provide our customers with a seamless transition from a product’s prototype through its final production. We offer full support for testing and process development. We also support design for manufacturing and a full-turnkey supply chain. This allows us to help with the development and continuous improvement of a product. Our services come with Fabrinet’s focus on quality, flexibility, and competitiveness, all of which we tailor to match the unique needs of our customers.

About this position

The position of Sr./Jr. Process Engineer Wire bond/Die Attach involves providing process instructions, handling process improvements, and transferring new products and technologies while ensuring customer expectations are met.

Responsibilities

• Provide process instruction for manufacturing.
• Handle process improvement for ultimate yield & quality, less scrap and cycle time.
• Conduct engineering change and evaluation.
• Transfer new products, process, tooling, equipment and technology as assigned by Supervisor.
• Provide accurate data/report or recommendation to higher management if required.
• Prepare presentation package to management.
• Know your customer's expectations and drive section to meet them.
• Perform related work as assigned.

Requirements

• Bachelor's degree in Engineering or related field.
• 4-7+ years experiences in Test Engineer in telecommunication or electronic business is preferable.
• Leadership, Negotiation, Communication and Able to work under pressure.
• Technical Skill, Failure Analysis and Presentation Skill.
• Excellent Statistical Process Control and Data Analysis.
• Good Command of English.
• Knowledge of Wire bond, Die Attach, Wafer dicing (optional).