Engineer, Manufacturing Process

Celestica (Laem Chabang, Thailand)

Chonburi, Thailand

Celestica enables the world's best brands. Through our recognized customer-centric approach, we partner with leading companies in aerospace and defense, communications, enterprise, healthtech, industrial, semiconductor capital equipment, and smart energy to deliver solutions for their most complex challenges. A leader in design, manufacturing, hardware platform and supply chain solutions, Celestica brings global expertise and insight at every stage of product development - from the drawing board to full-scale production and after-market services. With talented teams across North America, Europe and Asia, we imagine, develop and deliver a better future with our customers. The Celestica Thailand facility has been established since 1995. Being Celestica’s biggest manufacturing site globally, we employ more than 5,000 employees. Our highly skilled teams produce high technology, high quality products for customers in the communications and enterprise market segments. With unrivalled expertise in high-mix low-volume manufacturing, direct fulfillment, reverse logistics and test development, we enable our customers to realize greater value, potential and outcomes.

About this position

The Engineer, Manufacturing Process is responsible for designing, developing, deploying and optimizing processes for manufacturing to achieve quality cost and delivery goals for Celestica and its customers products.

Responsibilities

Performs tasks such as, but not limited to, the following:
• Supervise Technician to support company goals.
• WI, Control plan, PFMEA and FA documents support.
• Continuous process improvement activities utilizing wide variety of analytical techniques (such as SPC, DOE, Gauge R&R), lean manufacturing and six sigma concepts.
• Leader in Product quality improvement, DFM, DFA, Engineering Evaluation.
• Process out control for problem solving.
• Evaluation of new material or component part use in production.
• Evaluation and develop Process and new Technology.
• Overseas travel is required, ~30% work load

Requirements

Knowledge/Skills/Competencies Refer to technical skills below Typical Experience
• 3+ years Experience in die bonding, flip chip attach, glob top, underfill, and die attach process development
• Work Experience and understand in optoelectronics assembly, microelectronics assembly
• Strong Knowledge of transceiver, modulator is an advantage
• Hands-on experience in machine set-up and operation for die bonders (DataCon, MRSI, Finetech, Amicra) is an advantage
• Proficient in root cause and failure mode Analysis
• Familiar with cleanroom and ESD protocols
• Knowledge of Auto CAD 2D, 3D or Solid work program.
• Excellent interpersonal skills and demonstrated communication skills.
• Self-motivated, proactive and innovative problem-solving capabilities, Management skill and Presentation skill.
Typical Education Bachelor or Master degree in Mechanical, Mechatronic, Electronics or relates Engineering degree