Back to job search

Die Bond Engineer

Celestica
Celestica (Chon Buri)
Chonburi, Thailand 🇹🇭
Celestica
Celestica enables the world's best brands. Through our recognized customer-centric approach, we partner with leading companies in aerospace and defense, communications, enterprise, healthtech, industrial, semiconductor capital equipment, and smart energy to deliver solutions for their most complex challenges. A leader in design, manufacturing, hardware platform and supply chain solutions, Celestica brings global expertise and insight at every stage of product development - from the drawing board to full-scale production and after-market services. With talented teams across North America, Europe and Asia, we imagine, develop and deliver a better future with our customers. The Celestica Thailand facility has been established since 1995. Being Celestica’s biggest manufacturing site globally, we employ more than 5,000 employees. Our highly skilled teams produce high technology, high quality products for customers in the communications and enterprise market segments. With unrivalled expertise in high-mix low-volume manufacturing, direct fulfillment, reverse logistics and test development, we enable our customers to realize greater value, potential and outcomes.

About this position

The Die Bond Engineer is responsible for supervising technicians, supporting company goals, and leading continuous process improvement activities in die bonding and related processes.

Responsibilities

• Supervise Technician to support company goals
• WI, Control plan, PFMEA and FA documents support
• Continuous process improvement activities utilizing wide variety of analytical techniques (such as SPC, DOE, Gauge R&R), lean manufacturing and six sigma concepts
• Leader in Product quality improvement, DFM, DFA, Engineering Evaluation
• Process out control for problem solving
• Evaluation of new material or component part use in production
• Evaluation and develop Process and new Technology
• Overseas travel is required, ~30% work load

Requirements

• Bachelor or Master degree in Mechanical, Mechatronic, Electronics or relates Engineering degree
• Work Experience and understand in optoelectronics assembly, microelectronics assembly
• 3+ years Experience in die bonding, flip chip attach, glob top, underfill, and die attach process development
• Strong Knowledge of transceiver, modulator is an advantage
• Hands-on experience in machine set-up and operation for die bonders (DataCon, MRSI, Finetech, Amicra) is an advantage
• Proficient in root cause and failure mode Analysis
• Familiar with cleanroom and ESD protocols
• Knowledge of Auto CAD 2D, 3D or Solid work program.
• Excellent interpersonal skills and demonstrated communication skills.
• Self-motivated, proactive and innovative problem-solving capabilities, Management skill and Presentation skill.
• Ability to work in Laem Chabang.

Benefits

\
Huneety A.I Salary Estimate
30,000 - 50,000 THB per month